Equipment introduction:
Poly510P cropper is machining equipment for cutting silicon with diamond wire and it is widely used for machining of poly-silicon materials. Cutting and trimming the silicon bar through a reciprocating wire at high speed, it is much reliable with small footprint and easy operation.
Equipment function:
Servo Synchronous high-speed cutting
Cutting bar156x156x450mm
Wire speed 10～15m/s，±0.1m/s P.S, Stepless adjustable
Equipment advantages:
Low seam loss
Low cutting cost
High reliability
Low consumption
Technical parameter
|
Items |
Parameters |
|
Workpiece size |
160×160×450mm |
|
Wire diameter |
0.3 - 0.45mm |
|
Feed speed |
1 – 30mm / min |
|
Wire speed |
0 – 25m / s |
|
Acceleration time |
3s |
|
Wire consume |
3m / 刀口 |
|
Processing quantity |
10块 |
|
Cutting time |
10min |
|
Worktable moving speed |
0 – 300 mm / min |
|
Max. wire storage |
10000m（配套BS60工字轮，可直接上机切割） |
|
Wire tension |
0 – 130N |
|
Overall dimension |
4600×2300×1900mm |
|
Machine weight |
≈7500kg |
