GC-700 Silicon Wafering Machine

Equipment introduction

Using diamond wires to form a wire net which is controlled by servo synchronous motor to realize high speed cutting, this equipment meets national advanced standard.

Equipment function:

50-70μm Superfine electroplated diamond wire                               

Servo synchronous high-speed cutting

Cutting bar length 750mm(max850mm)

Wire speed 1800m/min

Small wheelbase cutting


Equipment advantages:

Low seam loss

Low cutting cost

Low cutting time

High speed and high production

High silicon cutting productivity


Technical parameters:

Items

Parameter

 Max. workpiece size

Max. □156mm×L750mmMax.850mm 

Wire moving mode

One way or Reciprocating

Max.  wire speed

1800m/min

Shaft centre distance

385mm

Wire diameter

50~70μm

Wire tension

4~20N

Wafering mode

Downward cutting

Feed speed

0.1~5mm/min

Max. wire storage

200km

DimensionsL×W×H

4400mm×2000mm×2900mm

Machine weight

14000kg

 


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