Equipment introduction
Using diamond wires to form a wire net which is controlled by servo synchronous motor to realize high speed cutting, this equipment meets national advanced standard.
Equipment function:
50-70μm Superfine electroplated diamond wire
Servo synchronous high-speed cutting
Cutting bar length 750mm(max850mm)
Wire speed 1800m/min
Small wheelbase cutting
Equipment advantages:
Low seam loss
Low cutting cost
Low cutting time
High speed and high production
High silicon cutting productivity
Technical parameters:
Items |
Parameter |
Max. workpiece size |
Max. □156mm×L750mm(Max.850mm) |
Wire moving mode |
One way or Reciprocating |
Max. wire speed |
1800m/min |
Shaft centre distance |
385mm |
Wire diameter |
50~70μm |
Wire tension |
4~20N |
Wafering mode |
Downward cutting |
Feed speed |
0.1~5mm/min |
Max. wire storage |
200km |
Dimensions(L×W×H) |
4400mm×2000mm×2900mm |
Machine weight |
14000kg |