Equipment introduction
Using diamond wires to form a wire net which is controlled by servo synchronous motor to realize high speed cutting, this equipment meets national advanced standard.
Equipment function:
50-70μm Superfine electroplated diamond wire
Servo synchronous high-speed cutting
Cutting bar length 750mm(max850mm)
Wire speed 1800m/min
Small wheelbase cutting
Equipment advantages:
Low seam loss
Low cutting cost
Low cutting time
High speed and high production
High silicon cutting productivity
Technical parameters:
|
Items |
Parameter |
|
Max. workpiece size |
Max. □156mm×L750mm（Max.850mm） |
|
Wire moving mode |
One way or Reciprocating |
|
Max. wire speed |
1800m/min |
|
Shaft centre distance |
385mm |
|
Wire diameter |
50~70μm |
|
Wire tension |
4~20N |
|
Wafering mode |
Downward cutting |
|
Feed speed |
0.1~5mm/min |
|
Max. wire storage |
200km |
|
Dimensions（L×W×H） |
4400mm×2000mm×2900mm |
|
Machine weight |
14000kg |
