Silicon Waering Diamond Wire
|
Product Type |
Core Diameter (μm) |
Diamond Wire Diameter (μm) |
Breaking Force(N) |
Single roll maximum length（km） |
Application |
|
Electroplated Diamond Wire |
60 |
75±3 |
≥13 |
50 |
Silicon Wafering |
|
65 |
80±3 |
≥15 |
|||
|
70 |
85±3 |
≥17.5 |
|||
|
80 |
95±3 |
≥21 |
|||
|
Resin Diamond Wire |
70 |
87±3 |
≥12 |
70 |
Silicon Wafering |
|
80 |
97±3 |
≥19 |
Electroplated Diamond Wire used for magnetic materials
|
Product model |
High-carbon wire diameter(μm) |
Finished wire diameter(μm) |
Breaking force(N) |
Max. Length of single roller(Km) |
Application |
|
Electroplated Diamond Wire |
120 |
170±10 |
≥40 |
30 |
Magnetic materials |
|
130 |
200±10 |
≥45 |
30 |
Magnetic materials |
Technical parameters (for silicon cutting):
|
Product model |
Base wire diameter(μm) |
Finished wire diameter(μm) |
Breaking force(N) |
Max. Length of single roller(Km) |
Application |
|
Electroplated Diamond Wire |
50 |
63±3 |
≥10 |
50 |
Silicon materials |
|
55 |
68±3 |
≥11 |
|||
|
60 |
75±3 |
≥13 |
|||
|
65 |
80±3 |
≥15 |
|||
|
70 |
85±3 |
≥17.5 |
|||
|
80 |
95±3 |
≥21 |
