Silicon Waering Diamond Wire

Silicon Waering Diamond Wire

Product Type

Core Diameter (μm)

Diamond Wire Diameter (μm)

Breaking Force(N)

Single roll maximum length(km)

Application

Electroplated Diamond Wire

60

75±3

≥13

50

Silicon Wafering

65

80±3

≥15

70

85±3

≥17.5

80

95±3

≥21

Resin Diamond Wire

70

87±3

≥12

70

Silicon Wafering

80

97±3

≥19


Electroplated Diamond Wire used for magnetic materials

Product model

High-carbon wire diameter(μm)

Finished wire diameter(μm)

Breaking force(N)

Max. Length of single roller(Km)

Application

Electroplated Diamond Wire

120

170±10

40

30

Magnetic materials

130

200±10

45

30

Magnetic materials


Technical parameters (for silicon cutting):

Product model

Base wire diameter(μm)

Finished wire diameter(μm)

Breaking force(N)

Max. Length of single roller(Km)

Application

Electroplated Diamond Wire

50

63±3

10

50

Silicon materials

55

68±3

11

60

75±3

13

65

80±3

15

70

85±3

17.5

80

95±3

21



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