Equipment Introduction
The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy.
Equipment Feature:
· Cutting stick length up to 4500mm
· Everything can be cut 7 knife edge
· 30 minutes to complete a cutting
Euipment Advantage:
· Low cutting loss
· High efficiency
· Reliable function
Technical Parameter:
|
Items |
Parameters |
|
Workpiece diameter |
φ150 – 270mm |
|
Workpiece length |
1000 - 5000mm |
|
Wire diameter |
0.25 - 0.42mm |
|
Processing quantity |
1根 |
|
Segment length |
230 – 850mm |
|
Cutting blade quantity |
9刀口（可根据需求增减奇数个） |
|
Feed speed |
0 – 300mm / min |
|
Wire speed |
0 – 25m / s |
|
Wire length |
10000m（配套BS60工字轮，可直接上机切割） |
|
Wire tension |
0 – 130N |
|
Cutting time |
2min / 刀口 |
|
Wire consume |
2m / 刀口 |
|
Overall dimension |
≈7150×1262×2263mm |
|
Worktable dimensions |
≈5270×864×775mm |
|
Machine weight |
≈12000kg |
