Equipment Introduction
The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy.
Equipment Feature:
· Cutting stick length up to 4500mm
· Everything can be cut 7 knife edge
· 30 minutes to complete a cutting
Euipment Advantage:
· Low cutting loss
· High efficiency
· Reliable function
Technical Parameter:
Items |
Parameters |
Workpiece diameter |
φ150 – 270mm |
Workpiece length |
1000 - 5000mm |
Wire diameter |
0.25 - 0.42mm |
Processing quantity |
1根 |
Segment length |
230 – 850mm |
Cutting blade quantity |
9刀口(可根据需求增减奇数个) |
Feed speed |
0 – 300mm / min |
Wire speed |
0 – 25m / s |
Wire length |
10000m(配套BS60工字轮,可直接上机切割) |
Wire tension |
0 – 130N |
Cutting time |
2min / 刀口 |
Wire consume |
2m / 刀口 |
Overall dimension |
≈7150×1262×2263mm |
Worktable dimensions |
≈5270×864×775mm |
Machine weight |
≈12000kg |