Mono809 Mono-silicon Cutting Machine

Equipment Introduction

The product named Mono807 Diamond Wire mono-silicon cutting machine is a machine using a diamond wire to cut and process mono-silicon ingots.It employs a processing technique in which silicon ingots are cut into sections with head and tailing ends cut off through a diamond wire reciprocating at high speed and complex control system. This machine is mainly used for processing mono-silicon , can simultaneously cause seven cuts and is a new machine with reliable functionality, high cutting efficiency and high processing accuracy.

Equipment Feature:

· Cutting stick length up to 4500mm

· Everything can be cut 7 knife edge

· 30 minutes to complete a cutting

Euipment Advantage:

· Low cutting loss

· High efficiency

· Reliable function

Technical Parameter:

Items

Parameters

Workpiece diameter

φ150 – 270mm

Workpiece length

1000 - 5000mm

Wire diameter

0.25 - 0.42mm

Processing quantity

1

Segment length

230 – 850mm

Cutting blade quantity

9刀口(可根据需求增减奇数个)

Feed speed

0 – 300mm / min

Wire speed

0 – 25m / s

Wire length

10000m(配套BS60工字轮,可直接上机切割)

Wire tension

0 – 130N

Cutting time

2min / 刀口

Wire consume

2m / 刀口

Overall dimension

7150×1262×2263mm

Worktable dimensions

5270×864×775mm

Machine weight

12000kg


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