Special Diamond Wire for Semiconductor
Special wire for slicing semiconductor silicon, stable, efficient, less wire break. Unique automatic control system, less fluctuation in sand volume, consistent cutting of products, uniform distribution of sand volume, high cutting efficiency; production process under high-definition monitoring equipment, traceable; special treatment process, good toughness of diamond wire, less wire break, abrasion resistant.
Product Parameters
Spec.& Model |
Diameter of Finished Wire(μm) |
Breaking force(N) |
Purpose |
45μm |
62±3 |
≥9 |
Silicon semiconductor carbide slicing |
65μm |
77±3 |
≥15 |
Silicon semiconductor carbide slicing |
70μm |
80±3 |
≥17 |
Silicon semiconductor carbide slicing |
70μm（12inch dedicated） |
82±2 |
≥17 |
Silicon semiconductor carbide slicing |
100μm |
111±3 |
≥29 |
Silicon semiconductor carbide slicing |
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