GC-800XCDiamond Wire Crystal Silicon Slicer

This product is used in the slicing stage of silicon wafer manufacturing and was launched in November 2024. Featuring an industry-leading adjustable small wheelbase design, it can accommodate the cutting requirements for silicon wafers of different sizes, including 16X/18X/210/220/230 mm, while simultaneously meeting the development needs of new-generation batteries such as HJT and TOPCon for large sizes, thin slicing, half-cells, and rectangular wafers.

It adopts a new cutting area layout with a maximum silicon ingot loading capacity of 950 mm. Using the latest cutting configuration, it enables cutting in multi-gear wheelbase modes spanning 315mm‒370mm (for 182mm products)‒400mm (for 210mm products)‒455mm at a wire speed of 2600 meters per minute. The application of lightweight high-precision wiring system realizes smaller tension fluctuation, the added tension of the whole machine is less than 1N, the comprehensive broken line rate is less than 5%, it has a variety of industry original functions, the stability of the whole machine is stronger, and the cutting efficiency is higher; it is more adaptable to fine wire and thin film, and can meet the stable cutting of wire diameter of 18μm and below. The comprehensive energy consumption is low, leading the industry. At the same time, it reserves a variety of automation interfaces, which can realize intelligent production operations and fine production control by using big data platform.