Building on research and development in precision cutting and grinding, and leveraging experience in cutting materials such as photovoltaic silicon, semiconductor silicon, and silicon carbide, Gaoce has successfully expanded to process a wide range of materials including glass, zircon, metals, lithium niobate, scintillation crystals, gallium arsenide, graphene, carbon-based composites, ceramics, and gallium oxide. The company has established strong partnerships with leading clients in these industries.
We are specialized in cutting hard and brittle materials, independently mastering high-speed, high-precision, and highly stable cutting control, as well as electroplating and chemical technologies. Gaoce holds 432 related technology patents.
Key components include the integrated cast bed frame and ultra-precision feed structure design. The equipment’s main spindle bearing box is custom-designed by the bearing box R&D team and manufactured in the company’s bearing box factory, ensuring reliable quality.
We adopt the photovoltaic-grade control logic with proprietary algorithms, offering fast response, minimal tension fluctuations, and high operational stability.
We perform simultaneous custom R&D of equipment, tools, and processes, with in-depth optimization in each area, and develop integrated solutions to form a closed-loop technology advantage, continuously delivering value to users.
We are equipped with high-precision machinery and high-Efficiency consumable production, specialized precision assembly lines, and automated production lines.
Our solutions are sold in 35 countries and regions worldwide, supported by a comprehensive and efficient after-sales service system and network.
