GC-BG202HAutomatic Grinder
This series of grinder is mainly designed for thinning of hard and brittle materials. It adopts In-feed processing principle, and the rotating wafer is ground through the rotation of grinding wheel and vertical feed. This model of grinder is optimized with high rigidity, suitable for efficient and high-precision processing of silicon carbide wafers in addition to using in wafer processing.
Product Parameters
1. Basic specifications |
|
Wafer processing size |
8 inch, 6 inch |
Wafer processing thickness |
0.1mm~1mm |
Grinding principle |
In-feed |
Grinding wheel size |
12 inch (300mm) |
Grinding mode |
Auto/manual |
Quantity of material boxes |
2 (compatible with 8 inch, 6 inch) |
Processing sides |
Single/double-sided thinning (selection via program) |
Weight |
9500KG |
Dimensions |
3050x1495x2180 |
2. Specifications of spindle |
|
Number of spindles |
2 (Z1, Z2) |
Form of spindle bearing |
Air bearing |
Motor power of spindle |
11KW |
Rotation speed of spindle |
1000rpm~3000rpm (Z1/Z2 can be set separately for the process) |
3. Specifications of Z-axis (Z1/Z2) |
|
Travel of Z-axis |
150mm |
Speed of Z-axis |
0.0001~0.08 mm/s |
Maximum speed of Z-axis |
50 mm/s |
Minimum movement distance of Z-axis |
0.1 μm |
Resolution of Z-axis |
0.1 μm |
4. Specifications of wafer table |
|
The numbers of wafer table |
3 (A、B、C） |
Form of wafer table bearing |
Air bearing |
Wafer adsorption on table |
Vacuum adsorption (the equipment is equipped with vacuum system) |
Speed of wafer table |
0~500rpm (set separately for each wafer table) |
Switching mode of wafer table |
Air turntable |
Cleaning method for tablet table |
Oilstone/two-fluid/brush |
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